An article on elektroniknet.de

pb tec solutions has completed in 2022, a contract with a Micro-Assembly Technologies (MAT) for the representation of the die Attach systems in Germany, Austria and Switzerland.

MAT is specialized in the development and manufacture of The die Attach systems for microelectronics Assembly. The Attach is the first and most important process in the Assembly of high-quality micro-electronic components and systems. The MAT-Attach systems to place and connect developed (bonding) semiconductor components such as ASICs, microprocessors, Sensors, MMICs, MEMS VCSELs and photodiodes to be precise in their Housings with the help of glue or metallurgical process (Eutectic, thermo-compression, ultrasonic, Ag-sintering).

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