New: The PLACE-N-BOND Underfilm process was developed to reduce fatigue defects in solder joints caused by shocks and vibrations in connection with brittle lead-free solder joints and the reduced size of solder joints, especially in BGA miniaturization.

The application is extremely simple using existing tape feeders on the existing pick & place systems in the SMT assembly lines.

Underfilm does not react with solder paste or flux and over a billion units are already in use.