Tested and approved: PLACE-N BOND Underfilm - the alternative to underfill!

The technology for this was developed back in 2003 together with a leading manufacturer of mobile devices and has been used in large quantities worldwide in a wide variety of products since 2005. For example, in smartphones, wearables, GPS trackers, police radio systems, portable printers, industrial control systems and much more.

Pre-cut dry film adhesive strips in suitable sizes are fed using standard tape and reel feeders and can be placed directly in the SMD pick and place machine. Investment costs for a dispenser are eliminated, making it very easy to plan projects with new products.

Place and Bond also impresses with its versatility. Using it to improve the resistance of BGAs in drop tests is just the beginning. Nowadays, new areas of application can be found, for example, in the bonding of flex and rigid boards. Until recently, only dispensing could be used here, which involved a curing process and therefore longer production times. Thanks to place and bond, nothing changes in the production process. The pre-cut dry film adhesive strips are simply fed into the pick and place machine and the underfilling and curing then takes place in the oven, virtually parallel to the soldering process.

Several materials are available for different applications.

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