Wherever Dispensing was previously the only solution, Place-N-Bond products offer a new, technically and economically interesting alternative. The pre-cut dry film adhesive strips are simply fed inside the placement machine and then underfilled and cured in the oven parallel to the soldering process.

The demands placed on modern electronics are increasing from year to year. A smartphone must be able to withstand the dry and hot air of the Arab Emirates as well as fulfill its function while skiing in the alps. These and other modern companions tend to fall to the ground in daily use or are exposed to other mechanical stresses or climatic influences. Nevertheless, we expect the devices to function flawlessly under all these conditions. Heat, cold, moisture, shocks and impacts - there is no room for failure. Particularly in safety-relevant areas, such as automotive, aerospace, safety and medical technology, the demands placed on products are constantly increasing. .....

Click here to read the full article (in German):
https://www.all-electronics.de/stabile-bga-loetverbindungen-ohne-dispensen/

All Electronics, 24.06.2020