PLACE-N-BOND Underfilm RP 113178
New: The PLACE-N-BOND Underfilm process was developed to reduce fatigue defects in solder joints caused by shocks and vibrations in connection with brittle lead-free solder joints and the reduced size of solder joints, especially in BGA miniaturization.
The application is extremely simple using existing tape feeders on the existing pick & place systems in the SMT assembly lines.
Underfilm does not react with solder paste or flux and over a billion units are already in use.
RP 113178 has been especially designed for low temperature processes.
More Information
PLACE-N-BOND Underfilm RP 113178
New: The PLACE-N-BOND Underfilm process was developed to reduce fatigue defects in solder joints caused by shocks and vibrations in connection with brittle lead-free solder joints and the reduced size of solder joints, especially in BGA miniaturization.
The application is extremely simple using existing tape feeders on the existing pick & place systems in the SMT assembly lines.
Underfilm does not react with solder paste or flux and over a billion units are already in use.
RP 113178 has been especially designed for low temperature processes.
More Information
Features
| Hardness Shore | A 94A |
|---|---|
| Tensile Modulus | 1200 PSI |
| Vicat Softening Point | 177 F |
| Specific Gravity | 1.22/cc |
| CTE | 85 uin/in F |
Features
| Hardness Shore | A 94A |
|---|---|
| Tensile Modulus | 1200 PSI |
| Vicat Softening Point | 177 F |
| Specific Gravity | 1.22/cc |
| CTE | 85 uin/in F |
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